CMP, Often known as thermal oxidation sharpening, makes use of MP along side chemical compounds to enhance the MRR and boost surface area excellent [twenty]. Figure two illustrates the schematic of a standard CMP process [21]. The SiC wafer, which is preset on the provider, as well as sharpening pad https://www.quora.com/profile/Trevor-Flatcher-2/Innovative-Applications-of-Silicon-Carbide-in-Medical-Devices-Silicon-carbide-SiC-has-emerged-as-a-revolutionary-mate